| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing accelerator useful for various curable resin compositions, an epoxy resin composition excellent in curability, preservability and flowability, and a semiconductor device excellent in solder crack resistance and moisture resistance reliability. SOLUTION: This epoxy resin composition comprises a compound (A) having≥2 epoxy groups in one molecule, a compound (B) having≥2 phenolic hydroxy groups in one molecule, a curing accelerator (C) expressed by general formula (1) and an inorganic filler (D), where in formula (1), R<SP>1</SP>-R<SP>3</SP>denote each a monovalent organic group having a substituted or non-substituted aromatic ring or heterocyclic ring or a monovalent aliphatic group; Ar denotes a substituted or non-substituted divalent aromatic group; Y<SP>1</SP>-Y<SP>4</SP>are each a group derived from a monovalent proton-donating group which has released the proton and forming a chelate structure upon binding with a silicon atom. COPYRIGHT: (C)2005,JPO&NCIPI
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