Miniaturised surface mount optoelectronic component

摘要

The invention relates to a miniaturised surface mount optoelectronic component. An electrically conductive material ( 1 ) preferably metal frame is used to serve as the base for the assembly. Optionally a cavity ( 2 ) may be formed within this electrically conductive base material to serve as a reflector cup. An optoelectronic chip ( 3 ) is mounted within this cavity. The whole base material is then encapsulated with a hard transparent or translucent resin material ( 4 ) so that optical radiation may be transmitted or received via this medium. Electrical connection(s) between the chip and the base material is provided by a metallic wire or wires ( 6 ).