| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer transfer apparatus which can prevent damage to a wafer caused by the missing of particles of a substance constituting an attractor for attracting and holding the wafer. SOLUTION: The attractor 100 constituting the wafer transfer apparatus 1 is porously formed by the solid-phase sintering of a silicon carbide particle. Since a binder is not used, the particle constituting the attractor 100 is not internally provided in an unstable state, and the particle does not give any damage to the wafer W caused by being chopped on the wafer W. COPYRIGHT: (C)2007,JPO&INPIT |
