| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating apparatus which makes the etching time constant on the whole to uniformly etch the substrate, if the substrate carry-in time is delayed. SOLUTION: When a first detecting means 29a detects that a substrate K enters a treating area 20, the apparatus feeds a treating liquid on the substrate K to do a primary treatment, measures the lapse time from the entry of the substrate K until the carry-in completes as a substrate carry-in time, starts a secondary treatment after the complete entry of the substrate K, transports the substrate K at a standard transport speed to do the secondary treatment if the measured substrate carry-in time is within a reference carry-in time. The apparatus calculates a transport speed enough to solve the over-delay time if the substrate carry-in time is longer than the a reference carry-in time, and transports the substrate K at the calculated transport speed to do the secondary treatment. COPYRIGHT: (C)2007,JPO&INPIT
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