| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a service supply method capable of providing a method for addressing the quality of parts or materials even if there are causes for decreasing the working situation of a part packaging apparatus and deteriorating the quality situation of a part-packaged substrate in electronic parts supplied from a part manufacturer, adhesives provided from a material manufacturer, or the like. <P>SOLUTION: The service supply method includes a situation data reception step (S404) for receiving at least one of part quality situation data for indicating the quality situation of components or materials, working situation data for indicating the working situation of the part-packaging apparatus, and part-packaged substrate quality situation data for indicating the quality situation of the part-packaged substrate produced by the part packaging apparatus by a situation collection device provided at a production base; and an addressing method providing step (S408) for providing a method for addressing the quality of parts or materials by using at least one of the part quality situation data received in the situation data reception step, the working situation data, and the part-packaged substrate quality situation data. <P>COPYRIGHT: (C)2008,JPO&INPIT |
