| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component packaging method capable of packaging components with an appropriate down stroke of a nozzle when packaging components using a fixture substrate. <P>SOLUTION: The component packaging method allows components to be packaged on substrates 111a, 111b placed on the fixture substrate 110 by elevating the nozzle 112a for a component packaging machine 100 having a fitting head 112 having the nozzle 112a for holding components. In the component packaging method, the difference in the surface height between the substrates 111a, 111b, and the fixture substrate 110 is acquired, only the difference in the surface height of the down stroke of the nozzle 112a when packaging components on the substrates 111a, 111b is changed, and the nozzle 112a is lowered with the changed down stroke, thus packaging components on the substrates 111a, 111b. <P>COPYRIGHT: (C)2008,JPO&INPIT |
