| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus capable of easily and positively processing a surface to be processed of a work into a target shape by adding the shape of a processing mark. SOLUTION: The plasma treatment apparatus 1 executes plasma treatment for the surface 101 to be treated using plasma emitted from a plasma emitting section 80 while relatively moving the plasma emitting section 80 and the work 10 to etch the surface 101. The apparatus 1 has a storage means 60 for storing known information indicating the relation between the processing time in plasma treatment or the relative movement between the plasma emitting section 80 and the work 10 and the shape of processing mark to be formed on the processed surface 101; and a processing schedule data creating means for creating processing schedule data including the processing time or the movement speed and added with the shape of the processing mark on the basis of the information and the target profile data. The apparatus 1 executes etching work based on the plasma treatment for the surface 101 to be processed on the basis of the processing schedule data. COPYRIGHT: (C)2008,JPO&INPIT
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