| 摘要 |
PROBLEM TO BE SOLVED: To suppress a factor which deteriorate substrate characteristics by securing a pattern width which becomes broad enough in a power supply system pattern. SOLUTION: When in the process of arranging a via 4, a clearance 5 around the via 4 is divided into a clearance region continued by a predetermined number (6), the via 4 is arranged so that a power supply system pattern 6 of the width for one pitch is arranged continuously between the adjacent clearance regions. Moreover, the via 4 is arranged so that a signal wiring 3 does not cross the clearance region and is arranged in the region where the power supply system pattern 6 is arranged. Further, the via 4 is arranged in the center surrounded by a terminal 2 in a predetermined position in the terminal arrangement region where the terminal 2 of the semiconductor device is arranged with equal pitch in X direction and Y direction. COPYRIGHT: (C)2008,JPO&INPIT |
