发明名称 RESIN MOLD
摘要 PROBLEM TO BE SOLVED: To provide a resin mold with improved mold releasing properties (releasing properties) from a light-curable resin without spoiling transferring properties and flatness of an obtained molded body. SOLUTION: The resin mold for molding the light-curable resin has a warpage in the same direction, and warped to form a concave face having a mean warpage of 50-700μm at all measuring points on the whole outer circumference, when the flat state of the mold having no warpage is set to zero. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008221643(A) 申请公布日期 2008.09.25
申请号 JP20070063813 申请日期 2007.03.13
申请人 NIPPON ZEON CO LTD 发明人 KURIHARA RYUTA;KATO MASATSUGU
分类号 B29C33/38;B29L17/00;G02B1/04;G11B7/26 主分类号 B29C33/38
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