摘要 |
PROBLEM TO BE SOLVED: To provide a resin mold with improved mold releasing properties (releasing properties) from a light-curable resin without spoiling transferring properties and flatness of an obtained molded body. SOLUTION: The resin mold for molding the light-curable resin has a warpage in the same direction, and warped to form a concave face having a mean warpage of 50-700μm at all measuring points on the whole outer circumference, when the flat state of the mold having no warpage is set to zero. COPYRIGHT: (C)2008,JPO&INPIT |