| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that, in conventional white member coated-type LED light emitting devices, a white member is filled in a side surface side of an LED while a light emitting surface of the LED mounted on a circuit board is exposed, and, after the white member is cured, a light transmitting member and a phosphor layer are bonded on the light emitting surface of the LED, so that there is a risk of causing adherence of a coating material on a light extraction surface of the LED, and extra processing such as polishing and removing may be required, resulting in a problem of production.SOLUTION: A light emitting device includes: a light emitting element; a phosphor plate which is bonded with a transparent adhesive on a light emitting surface of the light emitting element and larger than the light emitting surface of the light emitting element; a circuit board on which the light emitting element is flip-chip mounted; a first white member which fills and covers side surfaces of the light emitting element and a lower surface of the phosphor plate; and a second white member filled between the lower surface of the light emitting element and the circuit board. |
