| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an encapsulated semiconductor element and a manufacturing method of a semiconductor device capable of preventing a pressure sensitive adhesive that forms a pressure sensitive adhesive layer, from being deposited to a semiconductor element of the encapsulated semiconductor element when peeling the encapsulated semiconductor element including an encapsulation layer and the semiconductor element that is encapsulated by the encapsulation layer, from the pressure sensitive adhesive layer.SOLUTION: In the manufacturing method of an encapsulated optical semiconductor element 11, an optical semiconductor element 1 is encapsulated by an encapsulation layer 10 containing a thermally curable resin. After the encapsulated optical semiconductor element 11 including the optical semiconductor element 1 and the encapsulation layer 10 encapsulating it is obtained, the encapsulation layer 10 is heated in such a manner that a heat history H1 less than a heat history H0 in which the encapsulation layer 10 is completely cured is applied to the encapsulation layer 10. Thereafter, a pressure sensitive adhesion strength of a pressure sensitive adhesive sheet 77 is reduced, the encapsulation layer 10 is then heated in such a manner that a heat history H2 equal to or more than the heat history H0 in which the encapsulation layer 10 is completely cured is applied to the encapsulation layer 10. Thereafter, the encapsulated optical semiconductor element 11 is peeled from the pressure sensitive adhesive sheet 77.SELECTED DRAWING: Figure 1 |
