| 摘要 |
<P>PROBLEM TO BE SOLVED: To inexpensively produce a two-layer CCL and a two-layer flexible printed board excellent in processability, flexibility, resistance to HAI (high-current arc ignition) and hygroscopic characteristics and resins and insulator films used therefor. <P>SOLUTION: A polyamide-imide resin comprises a compound represented by general formula (1), a specific aromatic amide segment (2) or a specific aromatic imide segment (3) as an essential component, wherein the copolymerization ratio (mole ratio) is ä(1)}/ä(2)+(3)}=99/1-5/95. <P>COPYRIGHT: (C)2010,JPO&INPIT |
