| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device capable of equalizing the temperature distribution of a work in a conveyance path. SOLUTION: A heater 16 is provided at the heater mounting hole 15 in a rail 13, and lead frames 2, 3 are heated by heat from the heater 16. A supplying path 21 that supplies an anti-oxidation gas 22 is provided in the rail 13, and a supplying path 21 is formed in a folded form where the path turns back to one side after extended from one side to the other side of the rail 13. A heater proximity area 61 extended proximity to and along the heater 16 is formed at a through-hole 33 in the rail 13, and an area 62 where a return area 62 that turns back from the other end to one end of the rail 13 is formed at a return hole 43. COPYRIGHT: (C)2007,JPO&INPIT
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