| 摘要 |
PROBLEM TO BE SOLVED: To suppress generation of voids in a multilayer board produced by laminating a build-up layer, consisting of a prepreg, on the outer surface of a core layer as an insulation layer, and then sealing a plurality of inner layer interconnections, provided on the outer surface, with resin of the build-up layer.SOLUTION: A plurality of inner layer interconnections 511, 512, 521, 522 provided on the front and back surfaces 20a, 20b of a core layer 20 are classified to first interconnection groups 511, 521 and second interconnection groups 512, 522 with different wiring intervals. The second interconnection group has a wiring interval d2 narrower than the wiring interval d1 of the first interconnection group, and the thickness t2 of the inner layer interconnection in the second interconnection group is thinner than the thickness t1 of the inner layer interconnection in the first interconnection group. |
