| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated structure of first and second integrated circuit chips having the same number in which a first integrated circuit chip and a second integrated circuit chip as a pair are connected independently of each other and a common chip can be diverted even when the number of the chips to be laminated is changed.SOLUTION: A connection terminal P1(Y) of an upper layer is electrically connected to a connection terminal P1(Y-1) of a lower layer through an internal wire 40c, TSV 20 and a micro-bump 30 between a system LSI chip 100(N) and a system LSI chip 100(N-1). A connection terminal P2(Y) of a lower layer side chip is electrically connected to a connection terminal P2(Y-1) of an upper layer side chip through TSV 20, an internal wire 40d and a micro-bump 30 between a memory chip 200(N) and a memory chip 200(N-1). In a system LSI chip 100(1) and a memory chip 200(1), a connection terminal P1(Z) and a connection terminal P2(Z) are electrically connected to each other through the micro-bump 30. |
