| 摘要 |
Provided is a polymerizable composition which is a material for a film that imparts high molecule-blocking properties. The polymerizable composition comprises a lamellar compound (A), a solvent or dispersion medium (B) which has a boiling point lower than 150ºC at ordinary pressure, and a polymerizable compound (C) having a boiling point of 150ºC or higher at ordinary pressure, the ratio of the lamellar compound (A) to the polymerizable compound (C) being in the range of from 50:50 to 90:10 (by mass). The polymerizable compound (C) is a radical-polymerizable compound (C-1) or a cationically polymerizable compound (C-2). |
