| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate transfer device maintaining the temperature of an electronic component and a substrate increased when packaging even after packaging. SOLUTION: A heat block 33 is provided on a substrate transfer device 30 for moving the packaged substrate 4 onto a substrate carrier 20 so as to be disposed above the substrate 4 carried by the substrate carrier 20. The heat block 33 heats by radiation the substrate 4 from above and from below together with a post heat block 25 provided on the substrate carrier 20. A first heating surface 33a heating the substrate 4 which is being moved toward the substrate carrier 20 from above and a second heating surface 33c heating the substrate 4 which is being carried on the substrate carrier 20 from above are provided on the heat block 33 so as to have different heights. COPYRIGHT: (C)2010,JPO&INPIT
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