| 摘要 |
In the present invention, disclosed is a bonding position inspection device for inspecting bonding positions, on a rectangular substrate, of a rectangular bonded article that has been bonded so as to have four sides each parallel to the four sides of the substrate. This bonding position inspection device is provided with: an inspection table on which is formed a placement region for placing thereon a substrate to which a bonded article has been bonded; four optical measurement units that are mounted onto the inspection table, face four corners of the substrate and four corners of the bonded article, and optically measure distances between side edges of the bonded article and side edges of the substrate parallel to the side edges of the bonded article, at the four corners; and a measurement result display unit that is connected to the four optical measurement units and displays, as a measurement result, the distances respectively measured by the four optical measurement units. Due to this configuration, it is possible to improve the accuracy of inspection of bonding positions, on a rectangular substrate, of a rectangular bonded article that has been bonded so as to have four sides each parallel to the four sides of the substrate. |
