发明名称 膜動ポリマーマイクロフルイディクチップの基板と隔膜とを溶接する方法
摘要 The present invention discloses a welding method for substrate and membrane of membrane mobile polymer microfluidic chip, which relates to the manufacturing technology of membrane mobile polymer microfluidic chip and comprises the following steps: before the welding, the substrate is fixed, the surface of the substrate is covered with the membrane; the membrane is pressed against the surface of the substrate, and in the course of welding, the laser irradiates the welding area on the substrate through the membrane, and the welding area fuses and then welds the substrate and membrane together. The present invention realizes the firm welding between membrane and substrate of membrane mobile polymer microfluidic chip, and ensures that the weld face is flat and uniform.
申请公布号 JP5966006(B2) 申请公布日期 2016.08.10
申请号 JP20140525286 申请日期 2012.02.29
申请人 北京博暉創新光電技術股▲ふん▼有限公司 发明人 楊 奇
分类号 B23K26/57;B23K26/00;B23K26/066;B23K26/12;B23K26/70;B29C65/16 主分类号 B23K26/57
代理机构 代理人
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