| 摘要 |
PROBLEM TO BE SOLVED: To provide a system and a method for achieving more suitable control over the heating of a substrate and/or improving the cool down rate of a substrate in a thermal processing chamber.SOLUTION: A device 10 for heating a substrate 12 includes a heat source 26 to provide radiation in a first wavelength range and to heat the substrate within a predetermined temperature range. The substrate absorbs radiation within the predetermined temperature range, in a second wavelength range within the first wavelength range. The device also includes: a processing section including a substrate support 14 to support the substrate; and a filter disposed between the substrate support and the heat source to filter radiation from the heat source so that at least a portion of the radiation within the second wavelength range is not absorbed by the substrate, the filter using a reflective coating 50 covering a window 20.SELECTED DRAWING: Figure 1 |
