| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a power conversion device capable of reducing cost or the like and implementing reflow soldering processing with high time efficiency or the like.SOLUTION: The manufacturing method includes: a first step for placing a standby configuration body 11 in a formic acid gas atmosphere where the standby configuration body is boosted to a pressure equal to or higher than an atmospheric pressure, and maintaining the pressure; a second step for making temperatures of the formic acid gas atmosphere and the standby configuration body rise in such a manner that the temperature of the formic acid gas atmosphere becomes equal to or higher than a reduction initiation temperature of the formic acid and that the temperature of a resin case 3 becomes lower than a heat-proof lower limit temperature of the resin while bringing a solder 4a or the like into a molten state by making a temperature of the standby configuration body rise in such a manner that a temperature of the solder becomes equal to or higher than its melting temperature, and maintaining the temperatures together with execution of the first step; a third step for providing a vacuum atmosphere in which a pressure in an atmosphere of the standby configuration body is reduced into a vacuum state by exhausting the formic acid gas atmosphere continuously to the first and second steps; and a fourth step for solidifying the solder in the molten state by making the temperature fall continuously to the third step.SELECTED DRAWING: Figure 3 |
