发明名称 PARALLEL LOOP TYPE HEAT DISPERSION PLATE
摘要 PROBLEM TO BE SOLVED: To provide a parallel loop type heat dispersion plate for improving heat transport capacity by reducing the pressure loss of a working fluid generated in the parallel loop type heat dispersion plate for smoothing the circulation of the working fluid, and radiating the heat of an electrical heating element having high heat generation density with a low temperature difference. SOLUTION: In the parallel loop type heat dispersion plate, a plurality of straight pores are arranged in a flat substrate made of a highly heat-conducting material for forming a row of pores, headers are provided at both the upper and lower ends of the substrate, respective pores in the row of pores are allowed to communicate mutually by the headers and are sealed, and a bi-phase condensation working fluid is airtightly sealed into the row of pores. In the parallel loop type heat dispersion plate, at least either a straightening section for guiding from a pore that becomes the forward flow passage of the working fluid in the row of pores to a pore that becomes a reflux passage or a straightening section for guiding from the pore that becomes a reflux passage to the pore that becomes a forward flow passage is formed on an inner wall that opposes the pore of a channel for connecting the pore of the header. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006344636(A) 申请公布日期 2006.12.21
申请号 JP20050166649 申请日期 2005.06.07
申请人 FUJI ELECTRIC HOLDINGS CO LTD 发明人 TATSUKAWA MASAHIRO
分类号 H01L23/473;F28D15/02;H05K7/20 主分类号 H01L23/473
代理机构 代理人
主权项
地址