| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting assembly including a quantum cascade semiconductor laser face-down mounted on a sub-mount.SOLUTION: A mounting surface 15a of a sub-mount 15 includes a first area 15b, a second area 15c and a third area 15d arranged, in order, in the first direction (X axis direction). The first area 15b and the third area 15d support a first portion 13a and a fifth portion 13e of a quantum cascade semiconductor laser 13 via a solder material 37. The solder material 37 is provided across the first area 15b through the third area 15d of the sub-mount 15. The quantum cascade semiconductor laser 13 and the sub-mount 15 are arranged in the third direction (Z axis direction), and the quantum cascade semiconductor laser 13 is mounted on the sub-mount 15. A third portion 13c of the quantum cascade semiconductor laser 13 is spaced apart from the second area 15c of the sub-mount 15 by a distance GAP. |
