| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for inspecting foreign matter on a circuit board capable of specifying, in circuit board image data, a solder region having a paste-like solder applied thereto to exclude it from an attenuation processing object region and determining foreign matter in the solder region with high accuracy, thereby contributing to quality improvement.SOLUTION: Provided is a method for inspecting foreign matter on a circuit board by using a circuit board inspection device for image-capturing a circuit board having a print region and a solder region to acquire image data including a luminance value and applying arithmetic processing thereto, the inspection method comprising the steps of: estimating a solder luminance range which is a luminance range of the solder region on the circuit board; excluding a region corresponding to the solder luminance range from a high luminance region of image data of a non-defective circuit board and then performing attenuation processing to calculate non-defective image data; excluding a region corresponding to the solder luminance region from a high luminance region of image data of an inspection circuit board and then performing attenuation processing to calculate inspection image data; and determining the presence of foreign matter on the basis of a difference obtained by comparing the non-defective image data and the inspection image data. |
