Method and system for handling substrates

摘要

System and method for handling substrates in a lithography manufacturing process are disclosed. In one embodiment, a system for handling substrates in a lithography manufacturing process includes a plurality of porous chucks positioned above a substrate for imaging, a plurality of pressure sources configured to apply pressured air towards the substrate through the plurality of porous chucks, a plurality of vacuums configured to apply suction force away from the substrate, and a controller with control logic configured to hold the substrate in place by controlling the pressured air applied by the plurality of pressure sources and the suction force generated by the plurality of vacuums.

主权项

1. A method for handling substrates in a lithography manufacturing process, comprising:
providing a substrate for imaging, wherein the substrate is positioned underneath a plurality of porous chucks; applying pressured air towards the substrate through the plurality of porous chucks using a plurality of pressure sources; applying suction force away from the substrate using a plurality of vacuums; and holding the substrate in place by controlling the pressured air applied by the plurality of pressure sources and the suction force generated by the plurality of vacuums, wherein holding the substrate in place comprises: creating a plurality of optical paths, wherein each optical path includes an imaging unit that images a corresponding area of the substrate; detecting mechanical and optical variations in a subarea of the substrate corresponding to each optical path; and compensating for the mechanical and optical variations detected in each optical path.