| 摘要 |
A heat dissipation device for removing heat from a heat generating-component mounted on a printed circuit board includes a heat sink and two heat pipes. The heat sink comprises a base plate in contact with the heat-generating component, two conducting arms extending upwardly and obliquely from two opposite ends of the base plate, a plurality of first fins extending upwardly from top surfaces of the base plate and the two conducting arms, and a plurality of second fins extending downwardly from bottoms surfaces of the conducting arms. The two heat pipes each comprise an evaporating section received in the base plate, at least a condensing section received in one of the conducting arms and at least a connecting section connecting at least an end of the evaporating section and the at least a condensing section.
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