POLISHING DEVICE, AND POLISHING CONDITION MONITORING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a polishing device which can realize high-precision finishing performance.SOLUTION: A polishing device includes: a polishing table 30A which supports an abrasive pad 10; a top ring 31A which presses a substrate W against the abrasive pad 10; and an in-situ spectroscopic film thickness monitor 39 which has a film thickness sensor 40 arranged inside the polishing table 30A. The in-situ spectroscopic film thickness monitor 39 irradiates the substrate W with light and generates a spectrum of reflectance from the substrate W in order to determine a rotational angle of the substrate W by using the spectrum and to determine film thickness from the spectrum.