发明名称 |
SEMICONDUCTOR PACKAGE ASSEMBLY WITH PASSIVE DEVICE |
摘要 |
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first substrate (200). A first semiconductor die (300) is disposed on the first substrate. A passive device (400) is located directly on the first semiconductor die. The passive device is disposed within a boundary of the first semiconductor die in a plan view. |
申请公布号 |
EP3067928(A2) |
申请公布日期 |
2016.09.14 |
申请号 |
EP20160155798 |
申请日期 |
2016.02.16 |
申请人 |
MEDIATEK, INC |
发明人 |
KUO, CHE-HUNG;CHEN, YING-CHIH;CHOU, CHE-YA |
分类号 |
H01L25/16;H01L23/31;H01L25/065 |
主分类号 |
H01L25/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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