发明名称 |
CONDUCTIVE PARTICLES, METHOD FOR MANUFACTURING CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide conductive particles with which it is possible to reduce connection resistance between electrodes when the electrodes are electrically connected.SOLUTION: Conductive particles according to the present invention have solder on the surface of a conductive portion, and a group having at least one carboxyl group is bonded to the surface of the solder via a group including a group represented by formula (X).SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016186935(A) |
申请公布日期 |
2016.10.27 |
申请号 |
JP20160103944 |
申请日期 |
2016.05.25 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
ISHIZAWA HIDEAKI;UENOYAMA SHINYA |
分类号 |
H01B5/00;C08K9/02;C08K9/04;C08L101/00;H01B1/00;H01B1/22;H01B5/16;H01R11/01 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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