发明名称 CONDUCTIVE PARTICLES, METHOD FOR MANUFACTURING CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide conductive particles with which it is possible to reduce connection resistance between electrodes when the electrodes are electrically connected.SOLUTION: Conductive particles according to the present invention have solder on the surface of a conductive portion, and a group having at least one carboxyl group is bonded to the surface of the solder via a group including a group represented by formula (X).SELECTED DRAWING: Figure 1
申请公布号 JP2016186935(A) 申请公布日期 2016.10.27
申请号 JP20160103944 申请日期 2016.05.25
申请人 SEKISUI CHEM CO LTD 发明人 ISHIZAWA HIDEAKI;UENOYAMA SHINYA
分类号 H01B5/00;C08K9/02;C08K9/04;C08L101/00;H01B1/00;H01B1/22;H01B5/16;H01R11/01 主分类号 H01B5/00
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