DIE-BONDING FILM WITH DICING TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a die-bonding film with dicing tape which makes possible to suppress the accumulation of an air bubbles (voids) at the boundary between a die-bonding film and an object to stick the film to after a sealing step even on condition that a high-temperature thermal treatment is performed for a long time, and to suppress the occurrence of crack, fracture or chip, or a combination thereof in a film even if the film is transported or stored while remaining refrigerated.SOLUTION: A die-bonding film with dicing tape comprises: a piece of dicing tape; and a die-bonding film. The die-bonding film includes a thermoplastic resin (a), and a thermosetting resin (b) having a viscosity of 0.1-50 Pa sec at 25°C. The thermosetting resin (b) consists of at least one resin selected from a group consisting of an epoxy resin and a phenol resin. The content of the thermosetting resin (b) is 1-50 wt.% to all the resin components. The die-bonding film with dicing tape has a storage elastic modulus of 0.05 MPa or larger at 260°C after having been hardened by one-hour heating at 170°C.