| 发明名称 |
Electrically insulating thermal interface on the discontinuity of an encapsulation structure |
| 摘要 |
Method for manufacturing an electronic semiconductor package, in which method an electronic chip (100) is coupled to a carrier, the electronic chip is at least partially encapsulated by means of an encapsulation structure having a discontinuity, and the carrier is partially encapsulated, and at least one part of the discontinuity and a volume connected thereto adjoining an exposed surface section of the carrier are covered by an electrically insulating thermal interface structure, which electrically decouples at least one part of the carrier with respect to its surroundings. |
| 申请公布号 |
US2016372399(A1) |
申请公布日期 |
2016.12.22 |
| 申请号 |
US201615256640 |
申请日期 |
2016.09.05 |
| 申请人 |
Infineon Technologies AG |
发明人 |
FUERGUT Edward;MENGEL Manfred |
| 分类号 |
H01L23/367;H01L21/3105;H01L23/495;H01L23/00;H01L23/31;H01L21/56;H01L21/48 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. Method for manufacturing an electronic semiconductor package, wherein the method comprises:
coupling an electronic chip to a carrier; encapsulating the electronic chip at least partially and encapsulating the carrier partially by an encapsulation structure having a discontinuity; covering at least a part of the discontinuity and a volume connected thereto, which adjoins an exposed surface section of the carrier, with an electrically insulating thermal interface structure, which electrically decouples at least a part of the carrier with respect to a surrounding. |
| 地址 |
Neubiberg DE |
