发明名称 ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide electronic apparatus for reinforcing a circuit board, and for improving cooling efficiency of a heat generating component. <P>SOLUTION: The electronic apparatus 1 includes: a case body 4; a circuit board 11 stored in the case body 4; a heating component 21 mounted on the circuit board 11; a heat radiating member 14 stored in the case body 4; a conductor layer 24 installed on the circuit board 11, a heat receiving member 36 thermally connected to the heat generating component 21; a heat pipe 12 equipped with a first end 31a fixed to the heat receiving member 36 and a second end 31b thermally connected to the heat dissipating member 14, and fixed to the conductor layer 24; and a fixing member 38 for mounting the heat receiving member 36 on the circuit board 11. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007323160(A) 申请公布日期 2007.12.13
申请号 JP20060150034 申请日期 2006.05.30
申请人 TOSHIBA CORP 发明人 TANAKA MAKOTO
分类号 G06F1/20;H01L23/427;H05K7/20 主分类号 G06F1/20
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