发明名称 COOLING DEVICE FOR ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cooling device having high-efficiency cooling performance and moreover, has a small-size and thin, and a simplified structure for an electronic apparatus. <P>SOLUTION: The cooling device 3A for a heat generating body 2 of an electronic apparatus includes a heat receiving unit 31 for receiving the heat generated from the heat generating body 2, and a plurality of heat radiators 33 of a high heat transfer member (carbon graphite) for radiating the heat generated. Heat connection between the heat receiver 31 and the heat radiator 33 is conducted by using a heat connecting member 34. Heat connection with a heat radiator among a plurality of heat radiators 33 concurrently provided with the heat receiver 31 is switched by manipulation the heat connecting member 34. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007324191(A) 申请公布日期 2007.12.13
申请号 JP20060149800 申请日期 2006.05.30
申请人 HITACHI LTD 发明人 OGIJI KENJI
分类号 H05K7/20;G06F1/16;G06F1/20 主分类号 H05K7/20
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