发明名称
摘要 <p>A front-opening wafer transport module has a container portion with transparent shell and a central support structure which includes a machine interface exposed at the bottom of the module and integral wafer support columns extending upwardly in the container portion for supporting wafers. Additionally, the side walls of the shell have recessed portions with engagement members that cooperate with engagement members on removable handles. The handles utilize detents to lock into place in the recesses on the side walls of the carrier. Attachment of the handles to the side walls is accomplished without breaks between the interior and exterior of the module and without separate fastners.</p>
申请公布号 JP4206149(B2) 申请公布日期 2009.01.07
申请号 JP19980196035 申请日期 1998.07.10
申请人 发明人
分类号 B65D85/00;B65D85/86;B65G49/07;H01L21/673 主分类号 B65D85/00
代理机构 代理人
主权项
地址