发明名称 |
SOLID STATE IMAGE PICKUP DEVICE, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a solid state image pickup device capable of reducing flare component.SOLUTION: The solid state image pickup device has an insulation structure of an insulative material, which penetrates at least a silicon layer at the light receiving side. The insulation structure has a forward tapered shape in which the top diameter of an upper part located at the light receiving side of the silicon layer is larger than the bottom diameter. The solid state image pickup device is applicable, for example, to a rear surface irradiation type solid state image pickup device etc. |
申请公布号 |
JP2015029047(A) |
申请公布日期 |
2015.02.12 |
申请号 |
JP20140056608 |
申请日期 |
2014.03.19 |
申请人 |
SONY CORP |
发明人 |
DAICHI TOMOKAZU;CHIBA YOHEI;MIZUTA KYOHEI |
分类号 |
H01L27/14;H01L21/02;H01L21/3205;H01L21/768;H01L23/522;H01L27/146;H04N5/335;H04N5/359 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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