发明名称 SOLID STATE IMAGE PICKUP DEVICE, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a solid state image pickup device capable of reducing flare component.SOLUTION: The solid state image pickup device has an insulation structure of an insulative material, which penetrates at least a silicon layer at the light receiving side. The insulation structure has a forward tapered shape in which the top diameter of an upper part located at the light receiving side of the silicon layer is larger than the bottom diameter. The solid state image pickup device is applicable, for example, to a rear surface irradiation type solid state image pickup device etc.
申请公布号 JP2015029047(A) 申请公布日期 2015.02.12
申请号 JP20140056608 申请日期 2014.03.19
申请人 SONY CORP 发明人 DAICHI TOMOKAZU;CHIBA YOHEI;MIZUTA KYOHEI
分类号 H01L27/14;H01L21/02;H01L21/3205;H01L21/768;H01L23/522;H01L27/146;H04N5/335;H04N5/359 主分类号 H01L27/14
代理机构 代理人
主权项
地址