发明名称 |
Solder Paste |
摘要 |
A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste excels in terms of temporal stability and exhibits high joint strength at room temperature and at high temperatures. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising the following: 10-70 mass % of a powdered intermetallic compound comprising copper and tin and 30-90 mass % of a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux. |
申请公布号 |
US2016158896(A1) |
申请公布日期 |
2016.06.09 |
申请号 |
US201414783230 |
申请日期 |
2014.03.28 |
申请人 |
SENJU METAL INDUSTRY CO., LTD. |
发明人 |
Koroki Motoki;Yoshikawa Shunsaku;Okada Sakie;Itoyama Taro;Komuro Hideyuki;Hirai Naoko;Shimizu Keitaro |
分类号 |
B23K35/26;B23K35/362;C22C9/02;H05K1/09;C22C13/00;C22C13/02;B22F1/00;H05K1/02;B23K35/02;C22C12/00 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Tokyo JP |