SURFACE TREATED COPPER FINE PARTICLE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a surface treated copper fine particle excellent in oxidation resistance, capable of forming sintered film having good conductivity even with sintering at low temperature and capable of being manufactured with simple processes.SOLUTION: There is provided a surface treated copper fine particle excellent in oxidation resistance and having low temperature sinterability and having average particle diameter of 0.1 to 1.0 μm by mixing a copper fine particle obtained by conducting a chemical reduction method or a disproportionation reaction in a presence of a particle growth inhibitor with a solution containing a nitrogen containing organic article of 0.03 to 10 wt.% based on the copper fine particle after mixing with diluted sulfuric acid or without mixing with diluted sulfuric acid. There is provided a surface treated copper fine particle where the nitrogen containing organic article is a compound exemplified by the following formula.SELECTED DRAWING: None