发明名称 表面処理銅箔、それを用いた積層体、プリント配線板、電子部品及び表面処理銅箔の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a surface-treated copper foil excellent in peel strength, a laminate using the same, a printed wiring board, an electronic component and a production method of the surface-treated copper foil.SOLUTION: In a surface-treated copper foil having a surface-treated layer formed of chromium oxide, when being immersed as long as 30 seconds into a nitric acid bath having a concentration of 20 mass% and a temperature of 25°C in the state where only the surface of the surface-treated layer is exposed, after applying heat treatment of 250°C×10 min., the elution amount of copper into the nitric acid bath is 0.0030 g/25 cmor less.
申请公布号 JP6031332(B2) 申请公布日期 2016.11.24
申请号 JP20120249061 申请日期 2012.11.13
申请人 JX金属株式会社 发明人 神永 賢吾;福地 亮
分类号 C23C22/30;C23C28/00;H05K1/09;H05K3/24 主分类号 C23C22/30
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