| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in bonding property, and giving a cured material having a low elastic modulus and excellent in heat resistance, and an adhesive film equipped with the adhesive layer. SOLUTION: This adhesive composition contains (A) 100 pts.mass polyimide resin having a diorganopolysiloxane residue in its main chain, (B) 5-200 pts.mass epoxy resin and (C) an effective amount of an epoxy resin-curing catalyst, and also (D) 5-100 pts.mass hydrogenated 1,2-polybutadiene resin and/or hydrogenated 1,2-polybutadiene derivative resin based on 100 pts mass total of the (A), (B) and (C). COPYRIGHT: (C)2007,JPO&INPIT
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