| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate, in which after forming a wiring protection film on the surface of a wiring, an insulating film between the wirings is removed efficiently, and then, the insulating film can be formed on the surface of the substrate, while forming a void of a desired shape between the wirings. SOLUTION: The method includes a step of preparing the substrate, where the wiring is formed, in which the surface is exposed to the inside of the insulating film, and the periphery is covered with a barrier layer, a step of selectively forming a first wiring protection film on the exposed surface of the wiring, a step of removing by etching the insulating film between the wirings which forms the first wiring protection film on the surface, and a step of selectively forming a second wiring protection film on the surface of the first wiring protection film with the film as a base. COPYRIGHT: (C)2008,JPO&INPIT
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