MAGNETIC SENSOR MODULE

摘要

Provided is a magnetic sensor module which is reduced in sizes in a state where a magnetic sensor and a base material are electrically connected to each other by corner bump bonding. In the magnetic sensor module, a Z axis magnetic sensor (13c) is mounted on a base material (11) having a wiring (21) on the main surface, by using a die bonding resin (22) as a bonding material. Since the Z axis magnetic sensor (13c) having an electrode pad (23) on the bottom surface is mounted on the base material (11) by being inclined 90°, the electrode pad (23) is positioned on a side surface. On a surface of the Z axis magnetic sensor (13c) facing the main surface of the base material (11), a bonding material storing region which can be filled with the die bonding resin is arranged. The bonding material storing region is composed of a groove structure (24). The groove structure (24) is arranged at an end section close to the wiring (21) formed on the base material (11), on the surface facing the main surface of the base material (11) of the Z axis magnetic sensor (13c).