| 摘要 |
Provided is a wafer processing method whereby a wafer having an insulating seal for reinforcement mounted on a rear surface can be divided efficiently into individual devices. The wafer processing method for dividing a wafer having devices formed in multiple regions on a front surface into individual device chips along scheduled division lines comprises: a rear surface grinding process of attaching a protective tape to the front surface of a wafer and grinding the rear surface of the wafer, thereby forming a predetermined thickness; an insulating seal-for-reinforcement mounting process of mounting an insulating seal for reinforcement, which transmits infrared rays, on the rear surface of the wafer while exfoliating the protective tape; and an insulating seal-for-reinforcement curing process of curing the insulating seal for reinforcement by heating the same. The wafer processing method also comprises: a modified layer forming process of forming a modified layer along the scheduled division lines inside the wafer by radiating a laser beam along the scheduled division lines; and a wafer dividing process of dividing the wafer having the insulating seal for reinforcement mounted on a rear surface into individual device chips along the scheduled division lines having the modified layer having formed therealong by applying an external force to the wafer. |
