发明名称 RF Multi-Feed Structure To Improve Plasma Uniformity
摘要 A plasma source assembly for use with a processing chamber is described. The assembly includes a multi-feed RF power connection to a single or multiple RF hot electrodes.
申请公布号 US2016254124(A1) 申请公布日期 2016.09.01
申请号 US201615150968 申请日期 2016.05.10
申请人 Applied Materials, Inc. 发明人 Bera Kallol
分类号 H01J37/32 主分类号 H01J37/32
代理机构 代理人
主权项 1. A plasma source assembly comprising: a housing having an inner edge, an outer edge and side walls, the housing including an electrically grounded front face, the inner edge and outer edge defining a length and the side walls defining a width, the electrically grounded front face including holes to allow a gas to pass therethrough; an RF hot electrode within the housing spaced from the electrically grounded front face and defining a gap, the RF hot electrode including a plurality of holes to allow a gas to pass therethrough; a first coaxial RF feed line including an outer conductor and an inner conductor separated by an insulator, the outer conductor in electrical communication with electrical ground and the inner conductor in electrical communication with the RF hot electrode, the first coaxial RF feed line connecting to the RF hot electrode at a first distance from the inner edge of the housing; and a second coaxial RF feed line including an outer conductor and an inner conductor separated by an insulator, the outer conductor in electrical communication with electrical ground and the inner conductor in electrical communication with the RF hot electrode, the second coaxial RF feed line connecting to the RF hot electrode at a second distance from the inner edge of the housing, the second distance being greater than the first distance.
地址 Santa Clara CA US