发明名称 |
FRONT/BACK CONTROL OF INTEGRATED CIRCUITS FOR FLASH DUAL INLINE MEMORY MODULES |
摘要 |
In one implementation, flash memory chips are provided with an operating power supply voltage to substantially match a power supply voltage expected at an edge connector of a dual inline memory module. The one or more of the flash memory chips and a memory support application integrated circuit (ASIC) may be mounted together into a multi-chip package for integrated circuits. The one or more flash memory chips and the memory support ASIC may be electrically coupled together by routing one or more conductors between each in the multi-chip package. The multi-chip package may be mounted onto a printed circuit board (PCB) of a flash memory DIMM to reduce the number of packages mounted thereto and reduce the height of the flash memory DIMM. The number of printed circuit board layers may also be reduced, such as by integrating address functions into the memory support ASIC. |
申请公布号 |
US2016254061(A1) |
申请公布日期 |
2016.09.01 |
申请号 |
US201615133217 |
申请日期 |
2016.04.19 |
申请人 |
Virident Systems, Inc. |
发明人 |
Kanapathippillai Ruban;Okin Kenneth Alan |
分类号 |
G11C16/30;H01R12/72;H05K1/02;H05K1/18 |
主分类号 |
G11C16/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
San Jose CA US |