| 摘要 |
本发明系关于一种电子元件的制造方法，其系包含下列步骤：提供一基板，其具有一第一表面；提供一电子元件，该电子元件之至少一面具有导电块；使位于该电子元件之至少一面的该导电块固定于该基板的该第一表面以形成一整体组件，其中该导电块之间的间距系小于100微米，该电子元件与该基板之间的缝隙系小于50微米；从该电子元件的多个侧边施加一毛细型底部填充物(capillary underfill)，使该填充物沿着该电子元件与该基板之间的该缝隙爬行并填充该缝隙，以形成对该导电块之保护；将该整体组件置入一处理腔室中；使该腔室内的温度上升至一第一预定温度；使该腔室内的压力下降至为真空压力的一第一预定压力，并维持该真空压力经过一预定时间；使该腔室内的压力上升至大于1大气压力的一第二预定压力，并维持该第二预定压力经过一预定时间；及将该腔室内的温度调节至一第二预定温度。本发明亦关于一种用于电子元件的制造设备。; providing an electronic device, wherein at least one surface thereof has conductive bumps; mounting the bumps located on the at least one surface of the electronic device to the first surface of the substrate to form an integral unit, wherein the pitch between the bumps is less than 100μm, and the gap between the electronic device and the substrate is less than 50μm; applying a capillary underfill from multiple sides of the electronic device, such that the underfill creeps along the gap between the electronic device and the substrate and fills the gap, forming a protection for the bumps; placing the integral unit into a processing chamber; raising the temperature within the chamber to a first predetermined temperature; reducing the pressure within the chamber to a first predetermined pressure which is a vacuum pressure, and maintaining the vacuum pressure for a predetermined period of time; raising the pressure within the chamber to a second predetermined pressure which is more than 1 atm, and maintaining the second predetermined pressure for a predetermined period of time; and adjusting the temperature within the chamber to a second predetermined temperature. This invention also relates to an apparatus for manufacturing electronic devices. |
