发明名称 |
Elevated photodiode with a stacked scheme |
摘要 |
A device includes an image sensor chip having formed therein an elevated photodiode, and a device chip underlying and bonded to the image sensor chip. The device chip has a read out circuit electrically connected to the elevated photodiode. |
申请公布号 |
US9530811(B2) |
申请公布日期 |
2016.12.27 |
申请号 |
US201514841252 |
申请日期 |
2015.08.31 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Wan Meng-Hsun;Chu Yi-Shin;Chen Szu-Ying;Chen Pao-Tung;Liu Jen-Cheng;Yaung Dun-Nian |
分类号 |
H01L31/02;H01L31/0224;H01L27/146;H01L31/0352;H01L31/18;H01L31/0376 |
主分类号 |
H01L31/02 |
代理机构 |
Slater Matsil, LLP |
代理人 |
Slater Matsil, LLP |
主权项 |
1. A device comprising:
an elevated photodiode over a semiconductor substrate of an image sensor; and a semiconductor device bonded to the semiconductor substrate of the image sensor, wherein the semiconductor device comprises a read out circuit electrically coupled to the elevated photodiode. |
地址 |
Hsin-Chu TW |