| 发明名称 | Bonded body and power module substrate | ||
| 摘要 | The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu—P—Sn-based brazing filler material and a Ti material, wherein a Cu—Sn layer, which is positioned close to the ceramic member and in which Sn forms a solid solution with Cu, and an intermetallic compound layer which is positioned between the Cu member and the Cu—Sn layer and contains P and Ti, are formed at a bonded interface between the ceramic member and the Cu member. | ||
| 申请公布号 | US9530717(B2) | 申请公布日期 | 2016.12.27 |
| 申请号 | US201414913648 | 申请日期 | 2014.08.18 |
| 申请人 | MITSUBISHI MATERIALS CORPORATION | 发明人 | Terasaki Nobuyuki;Nagatomo Yoshiyuki |
| 分类号 | H01L23/373;B23K35/02;H01L23/473;H01L23/15;H01L21/48;H01L23/498 | 主分类号 | H01L23/373 |
| 代理机构 | Locke Lord LLP | 代理人 | Locke Lord LLP |
| 主权项 | 1. A bonded body comprising: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu—P—Sn-based brazing filler material and a Ti material, wherein a Cu—Sn layer, which is positioned close to the ceramic member and in which Sn forms a solid solution with Cu, and an intermetallic compound layer which is positioned between the Cu member and the Cu—Sn layer and contains P and Ti, are formed at a bonded interface between the ceramic member and the Cu member. | ||
| 地址 | Tokyo JP | ||