发明名称 |
Vacuum package fabrication of integrated circuit components |
摘要 |
A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.
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申请公布号 |
US2005042839(A1) |
申请公布日期 |
2005.02.24 |
申请号 |
US20040967764 |
申请日期 |
2004.10.18 |
申请人 |
RAYTHEON COMPANY, A DELAWARE CORPORATION |
发明人 |
SYLLAIOS ATHANASIOS J.;GOOCH ROLAND W.;SCHIMERT THOMAS R. |
分类号 |
B81B7/00;H01L21/00;H01L21/30;H01L21/44;H01L21/46;H01L21/48;H01L23/12;(IPC1-7):H01L21/44 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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