| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a material excellent in compressibility and thermal conductivity, suitable for use as a boundary material for effectively dissipating heat generated from constituent parts of an integrated circuit. <P>SOLUTION: The composite article comprises thermally conductive particles and hollow polymer particles non-electroconductive, expandable by energy and has a polytetrafluoroethylene matrix. Preferably, the thermally conductive particles are selected from a metal, a metal oxide, metal powder, metal beads, metal fibers, metal-coated fibers, metal flakes, a metal-coated metal and further contains a silicone elastomer material. The silicone elastomer material is laid in the composite article in a discontinuous state. Preferably, the composite article has less than 1.5 g/cc of density and <35 of Shore A hardness. <P>COPYRIGHT: (C)2008,JPO&INPIT |
