| 摘要 |
The present invention relates to a semiconductor device with enhanced signal transmission properties. Multiple wires (16) of a wiring substrate mounting semiconductor chips include wires (16SG1) configuring differential pairs for transmitting differential signals and other wires (16SG2). Each of the wires (16SG1, 16SG2) includes: parts (PT1) in parallel with each other as spaced apart by a separation distance (SP1); parts (PT2) which are arranged on the same wire layer as the parts (PT1) and are in parallel as spaced apart by another separation distance (SP2); and parts (PT3) which are arranged between the parts (PT1, PT2) and are arranged to bypass in a direction for making another separation distance therebetween greater than the separation distances (SP1, SP2). |
